(2) InFO -2.5D封裝手藝
WLP = Wafer-Level Package
MCM = Multi-Chip-Module
線路較為簡單，可以將多餘的空間供給給晶片
●InFO 整合型扇出(InFO)特點就是整合扇出封裝手藝(Fan-out)製程，
(相同水龍頭節制水量的功能)
以下內文出自: https://platoco.pixnet.net/blog/post/343127903FT-RF Antenna
●合用於射頻()類型 : 例如蘋果(Apple)的iPhone 7採用InFO製程。
PoP = Package on Pakage
MOS 元件功用 : 行使閘極ON/OFF電壓節制電子流通數目
來支援多晶片的堆疊，並供給無崛起(Bumpless)接合結構，以實現更佳
手藝，仍然特別很是吸引廠商採納。
SiP = System in Package
底層Substrate根底上採用矽基板。
就是有兩個基板(Substrate)概念。中間那層基板為矽中介層
●應用TSV(Through Silicon Via)和晶圓(Chip-on-wafer)接合製程
Military handhelp Manpack antenna
InFO = Integrated Fan-Out 整合扇出型封裝
MCP = Multi-Chip-Package
TSV = Through-silicon Vias 矽穿孔
●適用於高速傳輸設計, 例如賽靈思(Xilinx)FPGA就是採取這類設計。
MOS-FET = Metal Oxide Semiconductor Field Effect Transistor 簡稱 MOS
CoWoS = Chip on Wafer on Substrate 基板上晶圓上封裝
The FT-RF main profession in R&D and manufacturing of antenna, be alongside of to be subjected to any OEM of nation and ODM, provide the product of the best quality and let the sale has the price of competition ability most , is the target that the FT-RF has been making great effort.
SOI = Silicon On Insulator 絕緣體上覆矽
■IC封裝手藝
■MOS元件的封裝演進 : FD-SOI VS. FinFET
文章標籤
全站熱搜
WoW = Wafer on Wafer 多晶圓堆疊封裝
CMOS (由P-MOS與N-MOSThe FT-RF main profession in R&D and manufacturing of antenna, be alongside of to be subjected to any OEM of nation and ODM, provide the product of the best quality and let the sale has the price of competition ability most , is the target that the FT-RF has been making great effort.構成)
【TIPS】MOS為MOS-FET簡稱; MOS元件根底有三: P-MOS , N-MOS ,
20~30%，同時散熱效能也會更高。別的，分歧於CoWoS製程，InFO因為
(3)SoIC - 3D 封裝
■名詞
金屬－氧化物(絕緣體)－半導體場效電晶體
FT-RF Outoodr | Indoor | Horn |
1MHz to 70GHz Antenna , Design , Manufacture效能。
Antenna Design and manufacturing
FD-SOI = Fully Depleted Silicon-on-Insulator 全空乏絕緣上覆矽
可以堆疊更多不合的晶片，且中心無需有Interposer，也是以本錢下落
合營基板，上面堆疊Side by Side的不合晶片(包括邏輯晶片、DRAM)，
即使該手藝的散熱量和速度不及CoWoS，但本身便宜、散熱佳又支援
FinFET = Fin Field-Effect Transistor 鰭式場效電晶體
■系統整合1mhz to 70ghz any type antenna封裝類型與成長趨勢
●SoIC 適用於雲端和資估中心的運用。
(1)CoWoS - 2.5D封裝 ,或稱異質性封裝
半導體封裝針對各式元件需求,有著不合的封裝型式; 因此 , 在商量封裝前
SOS = Silicon on Sapphire 藍寶石上覆矽
■IC 封裝尺寸的利用範圍
也就是說晶片下方之外的區域，可以增加更多的Pin數目，同時在基板上面
當需要傳輸高速訊號時，即可採用CoWoS方案
HBM = High Bandwidth Memory
【TIPS】日本爽賣IC製造耗材,惦惦吃三碗公
先釐清半導體元件主類以下圖
■半導體元件分類
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SoIC = System on Integrated Chip 系統整合晶片封裝
(Interposer,可以選用有機材料)，用來做為晶片和底層Substrate的
文章出自: https://farajiu00pu4w.pixnet.net/blog/post/43548226-%E3%80%90%E6%99%B6%E7%89%87%E3%80%91%E5%88%86%E9
●CoWoS 手藝
IC封裝手藝可分為CoWoS (2.5D), InFO (2.5D),SoIC (3D)等類型，
AiP = Antenna in Package
以下文章來自: http://blog.udn.com/f7ec65e7/165650309
FT-RF Outoodr | Indoor | Horn | Military Antenna
引用自: https://thayerquiun85.pixnet.net/blog/post/45573943-%E3%80%90%E6%99%B6%E7%89%87%E3%80%91%E5%88%86%E9
Fei Teng Wireless Technology Co. Ltd
Taiwan Head Office & Manufacturer:
No.369, Sec. Litoushan, Wenshan Rd., Xinpu Township, Hsinchu County 305, Taiwan (R.O.C.) MAP
Tel: 886-3-5882899
Fax: 886-3-5882879
Vietnam Manufacturer:
Viet Nam FT - RF Joint Stock Company
Block P, Binh Xuyen Industrial Area, Huong Canh Township, Binh Xuyenstrict, Vinh Phuc County, Viet Nam.
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